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Unmounted Chip Carrier Toolkit
Leit-C-Plast™ was originally developed for holding specimens on angled specimen holders
The wide rims (350-400µm) on the PELCO® Grids provide additional stiffness and minimize the potential of interfering with the sample when picking up and handling the grids with tweezers
Quantity=10
High Precision 5B 110mm NM-SS Au plated 0
PELCO® High Performance Silver Paste <20 nm Unmounted Chip Carrier ToolkitDESCRIPTION PELCO High Performance Silver Paste, 50g Silver flakes in an inorganic silicate aqueous solution, specially formulated adhesive for demanding bonding applications such as: High temperature up to 927C (1700F) Ultra high vacuum no hydrocarbon, no VOC's Cryogenic temperatures (suitability depends on matching properties) The excellent thermal and electrical conductivity, coupled with the absence of hydrocarbons, makes this product ideal for
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