J-STD-033D Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices THT The IPC J-STD-003D standard describes

The IPC J-STD-003D standard describes solderability determinations that are made to verify that the printed board fabrication processes and subsequent storage have had no adverse effect on the solderability of those portions of the printed board intended to be soldered

y aquellos con un interés en el criterio de aceptación de ensambles electrónicos

(2) Lead Free Boards

(2) SOIC 14 IC Package

Released February 2017

J-STD-033D Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices THT The IPC J-STD-003D standard describesNOTE: This Product is Downloadable Only. Single User License, Non printable and Non Device Transferable . Requires Email address and contact information of End User. Please allow 24 to 48 hours for downloads to be accessible. Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture reflow sensitive components. These methods help avoid damage from moisture absorption and