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250K Qwin 0.50 Leaded Solder ball TSDC0011 When changing the BGA Bridge
250K Qwin 0.50 Leaded Solder ball TSDC0011 When changing the BGA Bridge
250K Qwin 0.50 Leaded Solder ball TSDC0011 When changing the BGA Bridge
250K Qwin 0.50 Leaded Solder ball TSDC0011 When changing the BGA Bridge

250K Qwin 0.50 Leaded Solder ball TSDC0011 When changing the BGA Bridge

SKU: 13024842080

4.3
USD1063.00 USD1087.00

Pay in 4 interest-free payments of $265.75 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Aug 22 - Aug 27

Description

When changing the BGA Bridge

Weight: 30g

ITE - 8517E

non-corrosive bleed resistant temp resistant from -50 to 210 C

non-curing

250K Qwin 0.50 Leaded Solder ball TSDC0011 When changing the BGA BridgeBall Size 0. 50 Quantity 250K Melting Range 180 to 205 degree celcius.

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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