Hypertec 512MB DIMM (PC133) (Legacy) memory module 0.5 GB 1 x 0.5 GB DRAM 2 V Design Cooling type

2 V Design Cooling type Heatsink Technical details Cooling type Heatsink Memory Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC Memory form factor 288-pin DIMM CAS latency 19 Memory voltage 1

Green Frequency band 2

Memory Buffered memory type Registered (buffered) Internal memory 16 GB Memory form factor 240-pin DIMM Memory ranking 2 ECC Yes Memory clock speed 1866 MHz Internal memory type DDR3 Features Buffered memory type Registered (buffered) Internal memory 16 GB Memory form factor 240-pin DIMM Memory ranking 2 ECC Yes Memory clock speed 1866 MHz Internal memory type DDR3

Memory Buffered memory type Unregistered (unbuffered) Internal memory 8 GB Component for Laptop Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Internal memory 8 GB Component for Laptop Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Component for PC/server Memory form factor 240-pin DIMM ECC No Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Component for PC/server Memory form factor 240-pin DIMM ECC No Memory clock speed 1333 MHz Internal memory type DDR3

Hypertec 512MB DIMM (PC133) (Legacy) memory module 0.5 GB 1 x 0.5 GB DRAM 2 V Design Cooling typeA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to