Hypertec 46U1060-HY (Legacy) memory module 2 GB DDR2 800 MHz ECC SDR SDRAM Memory Buffered memory type Registered

Memory Buffered memory type Registered (buffered) Internal memory 8 GB Memory form factor 240-pin DIMM Memory ranking 2 ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Registered (buffered) Internal memory 8 GB Memory form factor 240-pin DIMM Memory ranking 2 ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3

35 V Memory Buffered memory type Registered (buffered) Internal memory 16 GB Memory form factor 240-pin DIMM Memory voltage 1

Memory Buffered memory type Unregistered (unbuffered) Internal memory 2 GB Memory form factor 240-pin DIMM ECC No Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Internal memory 2 GB Memory form factor 240-pin DIMM ECC No Memory clock speed 1333 MHz Internal memory type DDR3

2 V Memory ranking 2 ECC Yes Memory clock speed 2400 MHz Internal memory type DDR4 Weight & dimensions Package width 10 mm Package depth 150 mm Package height 55 mm Package weight 30 g Packaging data Package width 10 mm Package depth 150 mm Package height 55 mm Package weight 30 g

Memory Buffered memory type Unregistered (unbuffered) Internal memory 4 GB Memory form factor 240-pin DIMM ECC No Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Internal memory 4 GB Memory form factor 240-pin DIMM ECC No Memory clock speed 1333 MHz Internal memory type DDR3

Hypertec 46U1060-HY (Legacy) memory module 2 GB DDR2 800 MHz ECC SDR SDRAM Memory Buffered memory type RegisteredA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to